| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent gap formation in a lower sealing resin layer of an electronic in-component so as to prevent solder flash phenomenon, in an in-component board. <P>SOLUTION: An in-component board is configured to include a first land electrode 3a and a second land electrode 3b arranged so as to be adjacent to each other on a plane, an electronic component 1, having a first terminal electrode 1a jointed to the first land electrode 3a via a first conductivity-type junction material 4a and a second terminal electrode 1b jointed to the second land electrode 3b via a second conductivity-type junction material 4b, and a sealing resin layer 5. The junction height of the first conductivity-type junction material 4a is set higher than that of the second conductivity-type junction material 4b to mount the electronic component 1 with a slant. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
