THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND SEMICONDUCTOR DEVICE

摘要

Provided are a thermosetting resin composition which is readily fabricated and can obtain a cured product having superior storage stability, thermal stability, and, furthermore, superior heat resistance while also maintaining high transparency and suppressing the generation of voids during bonding of a semiconductor chip; a flip-chip mounting adhesive which includes the thermosetting resin composition; a semiconductor device fabrication method which uses the flip-chip mounting adhesive; and a semiconductor device which is fabricated by using the semiconductor device fabrication method. The thermosetting resin composition contains an epoxy resin, an acid anhydride having a bicyclic skeleton, and an imidazole curing accelerator which is a liquid at room temperature.