Semiconductor device, has outer base whose upper section is arranged higher than upper section of inner base, where inner peripheral surface of outer base is in contact with outer peripheral surface of inner base

摘要

The device (100) has an electrode insertion base comprising a metallic outer base (5) fitted at a metallic inner base (4) such that an inner peripheral surface of the outer base is in contact with an outer peripheral surface of the inner base. An upper section of the outer base is arranged higher than an upper section of the inner base, when the inner and outer bases are fitted with one another. The insertion base is provided on a circuit pattern formed on an isolation substrate (1). The isolation substrate and the insertion base are sealed with sealing plastic (7).