MULTI-CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND ASSEMBLY OF THE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an organic laminate chip carrier and a multi-chip electronic package utilizing a plurality of semiconductor chips positioned on an upper surface of the carrier.

SOLUTION: An organic laminate chip carrier 2 is comprised of a plurality of conductive planes 4 and dielectric layers 5, and couples chips 3 to underlying conductors 8 on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequency connection between the semiconductor chips, and may also include an internal capacitor and/or thermally conductive member 13 for enhanced operational capabilities.

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