发明名称 Method of Encapsulating an Actuator having a Piezoelectric Actuator Stack
摘要 <p>The invention concerns an encapsulated actuator as well as a method of encapsulating an actuator/stack in an encapsulation member, which comprising at least an innermost heat shrinkable, polymeric sleeve member and an overlaying outermost, heat shrinkable, polymeric sleeve member. The sleeve members have each a different shrinkage temperature, wherein the shrinkage temperature of the outermost sleeve member is higher than the shrinkage temperature of the innermost sleeve member. The method comprising essentially the following steps: a. Arranging the stack inside the innermost sleeve member, b. Arranging the outermost sleeve member so as to overlay the innermost sleeve member(s), c. Placing the stack under vacuum so as to degas it, d. Heating the stack above the shrinkage temperature of the outermost sleeve member so as to shrink the outermost sleeve member, e. Placing the stack under atmospheric pressure f. Cooling the stack.</p>
申请公布号 EP2343746(A1) 申请公布日期 2011.07.13
申请号 EP20100150453 申请日期 2010.01.11
申请人 DELPHI TECHNOLOGIES HOLDING S.A.R.L. 发明人 BERLEMONT, JEAN-FRANCOIS;GRIS, CHRISTIAN;WINANDY, JEAN-PIERRE;VIT, ROMAIN
分类号 H01L41/053;F02M51/06 主分类号 H01L41/053
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