MATERIAL FOR SUBSTRATE COMPRISING INORGANIC FILLER HAVING MINUS -COEFFICIENT OF THERMAL EXPANSION AND LIQUID CRYSTAL THERMOSETTING OLIGOMER

摘要

PURPOSE: A composite material for a substrate comprising a thermosetting liquid crystal oligomer and inorganic filler of a negative thermal expansion coefficient is provided to improve mechanical, thermal, and physical properties of a circuit substrate by including inorganic filler of a negative thermal expansion coefficient. CONSTITUTION: A composite material for a substrate comprising a thermosetting liquid crystal oligomer and inorganic filler of a negative thermal expansion coefficient comprises: a thermosetting liquid crystal oligomer which has one or more soluble structure unit in a main chain and includes a thermosetting group at one or more of the terminals of the main chain; and inorganic filler having a negative thermal expansion coefficient. The soluble structure unit comprises a C4~C30 aryl-amine group or a C4~C30 aryl-amide group.