发明名称 ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To solve the following problems: even when a printed board as a mounting board is so designed that characteristic impedance matches 50 &Omega;, a bonding wire part as a transmission line for transmitting a high-speed signal has high impedance and such impedance variation may cause reflection of a signal and distortion of a waveform to influence characteristics as a semiconductor device, and also causes an increase in cost when a flip-chip connecting method for achieving impedance matching as the semiconductor device is employed. <P>SOLUTION: A reference bonding wire for supplying a return current corresponding to a desired signal is arranged adjacently to a bonding wire for supplying the desired signal. Further, cross-sectional shapes of those plurality of bonding wires are combinations of an ellipse and a polygon. Consequently, mismatching of characteristic impedance between the bonding wires and mounting board is relaxed. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011135025(A) 申请公布日期 2011.07.07
申请号 JP20090295730 申请日期 2009.12.25
申请人 RENESAS ELECTRONICS CORP 发明人 TSUKUDA TATSUAKI
分类号 H01L21/60 主分类号 H01L21/60
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