摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problems: even when a printed board as a mounting board is so designed that characteristic impedance matches 50 Ω, a bonding wire part as a transmission line for transmitting a high-speed signal has high impedance and such impedance variation may cause reflection of a signal and distortion of a waveform to influence characteristics as a semiconductor device, and also causes an increase in cost when a flip-chip connecting method for achieving impedance matching as the semiconductor device is employed. <P>SOLUTION: A reference bonding wire for supplying a return current corresponding to a desired signal is arranged adjacently to a bonding wire for supplying the desired signal. Further, cross-sectional shapes of those plurality of bonding wires are combinations of an ellipse and a polygon. Consequently, mismatching of characteristic impedance between the bonding wires and mounting board is relaxed. <P>COPYRIGHT: (C)2011,JPO&INPIT |