发明名称 |
Electrical connection structure, liquid ejection head, method of manufacturing same, and image forming apparatus |
摘要 |
The electrical connection structure includes: a first substrate which has a first electrode part; a second substrate which has a second electrode part opposing the first electrode part, and a wiring pattern connected to the second electrode part; an insulating cavity substrate which is disposed between the first substrate and the second substrate and has a through hole in a position corresponding to the first electrode part, the through hole being deeper that a sum of a height of the first electrode part and a height of the second electrode part and having an opening surface area not smaller that an area of the first electrode part; and conductive material which is filled in the through hole.
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申请公布号 |
US7971973(B2) |
申请公布日期 |
2011.07.05 |
申请号 |
US20060520582 |
申请日期 |
2006.09.14 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
MAEDA YASUHIKO |
分类号 |
B41J2/05;B41J2/045;B41J2/055;B41J2/16 |
主分类号 |
B41J2/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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