发明名称 Electrical connection structure, liquid ejection head, method of manufacturing same, and image forming apparatus
摘要 The electrical connection structure includes: a first substrate which has a first electrode part; a second substrate which has a second electrode part opposing the first electrode part, and a wiring pattern connected to the second electrode part; an insulating cavity substrate which is disposed between the first substrate and the second substrate and has a through hole in a position corresponding to the first electrode part, the through hole being deeper that a sum of a height of the first electrode part and a height of the second electrode part and having an opening surface area not smaller that an area of the first electrode part; and conductive material which is filled in the through hole.
申请公布号 US7971973(B2) 申请公布日期 2011.07.05
申请号 US20060520582 申请日期 2006.09.14
申请人 FUJIFILM CORPORATION 发明人 MAEDA YASUHIKO
分类号 B41J2/05;B41J2/045;B41J2/055;B41J2/16 主分类号 B41J2/05
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