发明名称 Electronic circuit board and its manufacturing method
摘要 A production process for making an electronic circuit substrate comprising: a patterning step of forming a respectively anodically oxidizable conductor pattern and distribution pattern connected to the conductor pattern on a substrate; and an anodic oxidation step of generating an oxide film from the conductor pattern and the distribution pattern by contacting an electrolyte solution with the conductor pattern and the distribution pattern and carrying out anodic oxidation while applying current thereto, the patterns serving as anodes, wherein the width or film thickness of the distribution pattern is at least partially set so that an insulator portion is formed in the anodic oxidation step in which an oxide film formed on one of the side walls of the distribution pattern is integrated with an oxide film formed on the other side wall.
申请公布号 US7968458(B2) 申请公布日期 2011.06.28
申请号 US20050666137 申请日期 2005.10.21
申请人 PIONEER CORPORATION 发明人 CHUMAN TAKASHI;OHTA SATORU;MIYAGUCHI SATOSHI
分类号 H01L21/44 主分类号 H01L21/44
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