| 摘要 |
<p>Process for recycling a support substrate (25) of a material substantially transparent to at least a wavelength of electromagnetic radiation, said process comprising: a) providing an initial substrate (10); b) forming (S1) an intermediate layer (15) on a bonding face of the support substrate (25) having an initial roughness, said intermediate layer (15) being of a material substantially transparent to at least a wavelength of electromagnetic radiation, c) forming (S2) an electromagnetic radiation absorbing layer (24) either on the bonding face (10b) of the initial substrate (10), and/or on the intermediate layer (15), d) bonding (S3) the initial substrate (10) to the support substrate (25) via the electromagnetic radiation absorbing layer (24), and e) carrying out irradiation (S4) of the electromagnetic radiation absorbing layer (24) through the support substrate (25) and the intermediate layer to induce separation of the support substrate (25) from the initial substrate.</p> |
