| 发明名称 |
METHOD FOR THE PLANARIZATION OF A SEMICONDUCTOR CHIP BY MEANS OF A SOLDER CONNECTION AND A SEMICONDUCTOR CHIP |
| 摘要 |
The invention relates to the use of a solder connection as a planarization plane in a semiconductor chip. The invention describes a semiconductor chip and a method for producing a semiconductor chip, wherein a metallic planarization plane has a planarization material (200) having a melting point below 600°C. |
| 申请公布号 |
WO2011072976(A1) |
申请公布日期 |
2011.06.23 |
| 申请号 |
WO2010EP67728 |
申请日期 |
2010.11.18 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;EISSLER, DIETER;PLOESL, ANDREAS |
发明人 |
EISSLER, DIETER;PLOESL, ANDREAS |
| 分类号 |
H01L33/00;B23K1/00;H01L21/60;H01L33/40;H01L33/62;H01L33/64 |
主分类号 |
H01L33/00 |
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