发明名称
摘要 An image sensor includes a base an image sensor chip, and a cooling element. The base includes an opening disposed in the base. The image sensor chip is connected electrically to the base and covers the opening. The cooling element is received in the opening and is connected thermally to the image sensor chip. Heat produced by the image sensor chip can be dissipated in time by the cooling elements in the image sensor. The cooling elements maintain the image sensor chip works under a temperature no more than the rated working temperature of the image sensor chip and therefore extend the life of the image sensor, and improve the image quality of the image sensor chip.
申请公布号 JP4705125(B2) 申请公布日期 2011.06.22
申请号 JP20080079309 申请日期 2008.03.25
申请人 发明人
分类号 H01L23/34;H01L23/02;H01L23/40;H01L27/14;H04N5/335 主分类号 H01L23/34
代理机构 代理人
主权项
地址