首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Chirurgische Klammervorrichtung mit einem Rücklaufsperrmechanismus
摘要
申请公布号
DE602008006639(D1)
申请公布日期
2011.06.16
申请号
DE200860006639T
申请日期
2008.06.20
申请人
ETHICON ENDO-SURGERY, CINCINNATI
发明人
BOUDREAUX, CHAD P.
分类号
A61B17/068;A61B17/072
主分类号
A61B17/068
代理机构
代理人
主权项
地址
您可能感兴趣的专利
DEVICE FOR COMPENSATING THE MOMENT INTERRUPT OF ELECTRIC POWER USING A CRT TO MINIMIZE THE MOMENT POWER OF A COMPLEX PRODUCT
METHOD FOR PROCESSING SURFACE OF PARTS INSIDE OF CHAMBER TO PREVENT CONTAMINATION
WOBBLE MEASURING DEVICE USING A LASER BEAM AND A MEASURING METHOD THEREOF, CONCERNED WITH ENABLING A USER TO EASILY RECOGNIZE AN AMOUNT OF DISPLACEMENT OF A MEASURED OBJECT, AND ENABLING A REAL-TIME MEASURING PROCESS TO IMPROVE QUALITY AND PRODUCTIVITY
BICYCLE HAVING AUXILIARY ELECTRIC DEVICES BUILT-IN WITH AID OF INTERNAL WIRING AND POWER SUPPLY THEREOF
DENIM TYPE BREATHABLE WATERPROOF FABRIC BEING THIN AND HAVING TOUCH LIKE SPUN YARN
BREATHABLE WATERPROOF FABRIC HAVING EXCELLENT BODY TEMPERATURE CONTROLLING ABILITY AND WEARING EFFECT, AND MANUFACTURING METHOD THEREOF USING POLYURETHANE RESIN CAPABLE OF FORMING UNIFORM FILM HAVING FINE PORES
HEIGHT ADJUSTABLE STOP-LOG HAVING A FLAP WEIR STRUCTURE CAPABLE OF CONTROLLING STREAM RATE AND WATER-STOPPING
METHOD FOR SAFE TELEPHONE SETTLEMENT OF CREDIT CARD USING ARS RECEIVING CREDIT CARD NUMBER THROUGH TELEPHONE BUTTONS
METHOD FOR MANUFACTURING GABION MESH MADE UP OF TWO LENGTHWISE IRON WIRE AND ONE HORIZONTAL IRON WIRE
MULTI-FUNCTIONAL ANTI-CRIME VIDEOPHONE FOR TALKING WITH A VISITOR THROUGH THE CONNECTION OF A MOBILE PHONE
ANTI-STATIC AND BIODEGRADABLE POLYESTER COPOLYMER WITH IMPROVED CUTTING PROPERTY, COMPRISING POLYLACTIC ACID, IONIC ORGANIC COMPOUND AND POLYALKYLENEGLYCOL, AND PROCESS FOR PREPARATION THEREOF
INSULATION STRUCTURE FOR AN ELECTRIC BULB SOCKET TO SIMPLIFY THE ASSEMBLAGE STRUCTURE OF AN INSULATOR AND THE ELECTRIC BULB SOCKET
液晶显示装置及其驱动方法
节省功率电路及方法
短时间内大量发送讯息之讯息传递系统
利用资料驱动架构的处理器对处理器之通讯
网路存取点装置及方法
一种具远红外线照射作用之奈米釉料
晶圆级晶片尺寸封装之制造方法及其结构
镀装置