MULTI-LAYER POLISHING PAD MATERIAL FOR CMP

摘要

MULTI-L/Y[--R POLISHING PAD MATERIAL FOR CMP ABSTRACT 5 THE INVENTION IS DIRECTED TO A RNULTI-LAVER POLISHING PAD FOR CHERNICAL-MECHANICLI POLISHING COMPRISING A POROUS POLISHING LAVER AND A POROUS BOTTOM LAVER, WHEREIN THE BOTTOM LAVER IS SUBSTANTIALLV COEXTENSIVE WITH THE POLISHING LAVER, THE POLISHING LAVER BEING JOINED TO THE BOTTOM LAVER WITHOUT THE USE OFAN ADHESIVE: THE POLISHING LAVER HAVING AN AVERAGE SURFACE ROUGHNESS. RA. THAT IS GREATER THAN THE RA OF THE BOTTOM LAVER. 10