发明名称 METHOD OF MANUFACTURING METAL PATTERN LAMINATE SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a metal pattern laminate substrate stably without degrading productivity. <P>SOLUTION: The method of manufacturing the metal pattern laminate substrate includes: a step (A) of forming a resist film in predetermined pattern on a metal film laminated on a substrate by a printing method; a step (B) of etching the metal film; and a step (C) of peeling the resist film away with an alkali solution. In the step (A), the resist film is formed by using an active energy ray-setting type resist ink composition principally containing a component (a) and a component (b). The component (a) is a monomer and/or oligomer having 3 to 10 ethyleneoxy groups and one or more ethylenically unsaturated groups in one molecule, and the component (b) is a resin having one or more carboxyl groups in one molecule and an acid value of &ge;50 to <200. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011103414(A) 申请公布日期 2011.05.26
申请号 JP20090258457 申请日期 2009.11.12
申请人 TORAY ADVANCED FILM CO LTD;TORAY IND INC 发明人 TOYOSHIMA YUTAKA;WAKAHARA RYUICHI
分类号 H05K3/06;C23F1/00;H01L21/027 主分类号 H05K3/06
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