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发明名称
Integrated semiconductor device comprising interconnection part for contact holes and another interconnection part for via holes aligned vertically each other
摘要
申请公布号
KR101035594(B1)
申请公布日期
2011.05.19
申请号
KR20030050039
申请日期
2003.07.22
申请人
发明人
分类号
H01L21/28
主分类号
H01L21/28
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代理人
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