VACUUM PROCESSING SYSTEM AND METHOD FOR SEMICONDUCTOR SUBSTRATE TO BE PROCESSED

摘要

PURPOSE: A vacuum processing method and a vacuum processing device for a semiconductor substrate are provided to prevent a cross contamination or foreign materials by forming a connection structure which exclusively opens and closes a vacuum process chamber and a vacuum transfer chamber. CONSTITUTION: A standby block(101) transfers a semiconductor wafer under atmospheric pressure and includes a box(106) including a standby transfer robot(109). A vacuum block(102) transfers the wafer under the decompressed atmosphere. A lock chamber(105) is located between a first vacuum transfer chamber(104) and a standby block. The lock chamber transfers the wafer by changing the pressure between the atmospheric pressure and the vacuum pressure.