发明名称 METHOD OF INSPECTING PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND INSPECTION DEVICE OF PRINTED CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of inspecting a printed circuit board capable of accurately performing automatic appearance inspection, a method for manufacturing the printed circuit board, and a device for inspecting the printed circuit board. <P>SOLUTION: A plurality of assembly sheets 100 are placed on an upper surface of a substrate adsorption platform 20A, and a pressing plate 31 is placed on the plurality of assembly sheets 100 placed on the substrate adsorption platform 20A such that the plurality of assembly sheets 100 are pressed by the pressing plate 31. In this state, a DC power supply device 23 is turned on and causes the upper surface of the substrate adsorption platform 20A to be charged, thereby causing the plurality of assembly sheets 100 to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate 31 placed on the plurality of assembly sheets 100 is removed while the upper surface of the substrate adsorption platform 20A is charged, and automatic appearance inspection is performed on the plurality of assembly sheets 100 adsorbed on the upper surface of the substrate adsorption platform 20A. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011095000(A) 申请公布日期 2011.05.12
申请号 JP20090246674 申请日期 2009.10.27
申请人 NITTO DENKO CORP 发明人 MURAKAMI KOSUKE;TOYODA YOSHIHIRO
分类号 G01N21/956;G01N21/84;H05K3/00 主分类号 G01N21/956
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