PURPOSE: A laminated chip device is provided to prevent a mistake while chip devices are mounted on a surface. CONSTITUTION: A first conductive pattern unit(C) is formed in an element and includes a through hole. A first conductive pattern unit(L1) is separated from the first conductive pattern unit in the element and is formed on the first conductive pattern unit. A third conductive pattern unit(L2) is separated from the first conductive pattern unit in the element, is formed in the lower part of the first conductive pattern unit, and is connected to the second conductive pattern unit through the through hole of the first conductive pattern unit. A resistance pattern unit is formed between the second and third conductive pattern units.
