| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mold structure for housing an inertial sensor capable of making wiring patterns on a substrate common, so as to allow the inertial sensor in the same structure to be used, regardless of the packaging format of the inertial sensor and an installation direction of a packaging substrate, and to provide a sensor system which uses the mold structure. <P>SOLUTION: The package of the inertial sensor includes an electrode on the bottom face, and is further, housed in a mold made of resin. The mold includes a first mold (31) for housing the package so that the bottom face of the package faces the surface of the substrate, and a second mold (41) for housing the package so that the side face of the package faces the surface of the substrate. The two molds include a lead frame where one end forms a connection section connected to the electrode and the other end forms a terminal connected to the substrate, and the arrangement of the terminal has the same shape, in the two molds. <P>COPYRIGHT: (C)2011,JPO&INPIT |
