<p>A test carrier (10) comprises a base member (20A) and a cover member (50A), which sandwich a die (90). A base film (40) of the base member (20A) has a preformed first circuit pattern (41) and a printing region (22), wherein a second circuit pattern (44) is to be formed by printing, and the second circuit pattern (44) is electrically connected to the first circuit pattern (41).</p>
