| 摘要 |
<p>PURPOSE: An electronic component mounting apparatus and an electronic component mounting method are provided to form accurately a wire pattern in a second substrate by detecting a reserved position for the wire pattern from a second substrate based on the certain position of the second substrate. CONSTITUTION: In an electronic component mounting apparatus and an electronic component mounting method, a die mounting apparatus(1) temporarily mounts a die(90) in a test carrier(60). The die mounting apparatus comprises a base feed part(10), a die feed port(20), an assembly unit(30). The base feed part forms a first wire pattern in the base member(70) and supplies it to the assembly unit. The die supply unit detects the position of the input-output terminal(91) of the die and supplied it to the assembly unit. The die supply unit includes a second transfer arm(21) and a second camera unit.</p> |
