发明名称 |
Light emitting device, method of manufacturing the same, light emitting device package and lighting system |
摘要 |
<p>A method of manufacturing a light emitting device according to the embodiment includes the steps of partially forming a first buffer layer on a growth substrate, in which the first buffer layer has a Young's modulus smaller than that of the growth substrate; and forming a light emitting structure layer on the growth substrate and the first buffer layer, in which the light emitting structure layer includes a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer interposed between the first and second conductive semiconductor layers.</p> |
申请公布号 |
EP2315266(A2) |
申请公布日期 |
2011.04.27 |
申请号 |
EP20100187825 |
申请日期 |
2010.10.15 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JEONG, HWAN HEE;KIM, SO JUNG;SONG, JUNE O;CHOI, KWANG KI |
分类号 |
H01L33/00;H01L33/22 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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