摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method that avoids forming a carbon layer 14 to protect a connector terminal pattern 131 in an unintended portion. SOLUTION: An insulating substrate 11, wherein a wiring pattern 13 including the connector terminal pattern 131 is formed, is arranged on a principal plane. Then, a carbon paste P is screen-printed to cover the connector terminal pattern 131. After that, an insulating protection layer 15, out of the wiring pattern 13, is formed to cover part of a circuit pattern 132, wherein at least the carbon paste P is not printed. COPYRIGHT: (C)2011,JPO&INPIT
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