发明名称 PROCESS FOR BONDING AND TRANSFERRING A LAYER
摘要 <p>PURPOSE: A process for bonding and transferring a layer on a substrate is provided to prevent the flaking and delaminating of a final substrate. CONSTITUTION: A laminate is formed by bonding a receiving substrate(2) with a donor substrate(1) through molecular adhesion. The laminate is thermally processed by reinforcing a bonding interface(5). The donor substrate is thinned by grinding. The donor substrate and the receiving substrate are annularly trimmed. The exposed surfaces of the receiving substrate and the residual part of the donor substrate are chemically etched.</p>
申请公布号 KR20110034540(A) 申请公布日期 2011.04.05
申请号 KR20100080983 申请日期 2010.08.20
申请人 S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES 发明人 LAGAHE BLANCHARD CHRYSTELLE
分类号 H01L27/12 主分类号 H01L27/12
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