发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus reducing the cost of an exhaust system. SOLUTION: The substrate processing apparatus includes a process chamber where a substrate is processed, a transfer chamber 12 provided with a transfer unit transferring the substrate to the process chamber, a plurality of decompressable spare chambers 14a, 14b coupled to the transfer chamber, an exhaust unit 50 connected to the spare chambers, a plurality of exhaust valves 61-63 respectively controlling exhaust of the spare chambers, second control means 89 controlling the exhaust valves, a plurality of exhaust valves 61-63 respectively controlling exhaust of the spare chambers, a second control means 89 controlling the exhaust valves, and a first control means 86 controlling the exhaust valves so that one of the exhaust valves is opened while the other exhaust valves are in a standing-by state to be opened. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011060910(A) 申请公布日期 2011.03.24
申请号 JP20090207412 申请日期 2009.09.08
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MIZUGUCHI YASUHIRO;OKUNO MASANORI;SAITO KAZUTO;HIROCHI SHIYU
分类号 H01L21/3065;C23C16/44;H01L21/31;H01L21/677 主分类号 H01L21/3065
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