| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for separating a semiconductor element, which prevents an element from separating at an undesired part by exerting sufficient tensile stress in the vicinity of a scribe groove even when a space of a substrate supporter is narrowed at the time of the reduction of the semiconductor element in size. SOLUTION: The device includes: a breaking blade 10 for separating an LD chip 2 by pressing the LD chip 2 on an LD bar 1; and a pair of substrate supporter 7 for supporting the LD bar 1; and supporter driving unit 16 for expanding the space of the pair of substrate supporter 7 synchronized with travel of the breaking blade 10 when pressing the breaking blade 10 on the LD bar 1. COPYRIGHT: (C)2011,JPO&INPIT |
