发明名称 PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
摘要 <p>A process for producing a semiconductor device in which a resistor is formed on the surface of a semiconductor substrate having a LOCOS oxide film, comprising: a polysilicon film formation step of forming a first polysilicon film along the boundary between the LOCOS oxide film and the semiconductor substrate so that the first polysilicon film covers the boundary; a resistor formation step of doping an impurity into the surface of the semiconductor substrate using the first polysilicon film as a mask to form the resistor; and a contact formation step of forming two or more contact holes on the resistor and forming a wiring layer that is connected to the contact holes and cannot directly connect the contact holes electrically to each other.</p>
申请公布号 WO2011030735(A1) 申请公布日期 2011.03.17
申请号 WO2010JP65253 申请日期 2010.09.06
申请人 KASAHARA, MASAKI;MITSUMI ELECTRIC CO., LTD. 发明人 KASAHARA, MASAKI
分类号 H01L21/822;H01L27/04 主分类号 H01L21/822
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