| 发明名称 |
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<p>Adhesiveness between a wiring layer and a resin layer is improved by forming a nitrided resin layer by nitriding a surface of a substrate by plasma, and furthermore, thinly forming a copper nitride film prior to forming a copper film.</p> |
| 申请公布号 |
KR20110026016(A) |
申请公布日期 |
2011.03.14 |
| 申请号 |
KR20117002676 |
申请日期 |
2009.05.29 |
| 申请人 |
NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY;DAISHO DENSHI CO., LTD. |
发明人 |
OHMI TADAHIRO;GOTO TETSUYA |
| 分类号 |
H05K3/38;H05K1/11;H05K3/18 |
主分类号 |
H05K3/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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