发明名称
摘要 PROBLEM TO BE SOLVED: To provide a method and device for sticking adhesive tape by which the unnecessary portion of the adhesive tape can be recovered by winding the portion so that the portion may not shrink in its widthwise direction after the adhesive tape is stuck to the surface of an article, such as the wafer etc., and the unnecessary portion is cut. SOLUTION: In the method of sticking the adhesive tape 4, the unnecessary portion of the tape 4 is recovered after the tape 4 is stuck to the surface of the article 2 and cut along the outer peripheral edge of the article 2. The unnecessary portion of the tape 4 is recovered by winding the portion so that the portion may not shrink in its widthwise direction. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP4640766(B2) 申请公布日期 2011.03.02
申请号 JP20040269417 申请日期 2004.09.16
申请人 发明人
分类号 H01L21/304;H01L21/683;H01L21/68 主分类号 H01L21/304
代理机构 代理人
主权项
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