发明名称 SUBSTRATE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
摘要 PURPOSE: A substrate structure and a manufacturing method of the same are provided to prevent Si from being melt-back through Ga by oxidizing the surface of a substrate and a pattern region after forming the pattern region. CONSTITUTION: A substrate structure comprises a substrate(20) and a buffer layer(22) The buffer layer is formed on the substrate by a certain pattern. A buffer layer is supported by a substrate protrusion which is formed after the surface of the substrate is etched. The bottom of a buffer layer which is not contacted with the substrate protrusion is exposed to outside. A nitride semiconductor layer is formed through lateral growth which is rapider vertical growth.
申请公布号 KR20110018105(A) 申请公布日期 2011.02.23
申请号 KR20090075733 申请日期 2009.08.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JUN YOUN;HONG, HYUN GI;TAK, YOUNG JO;LEE, JAE WON;JEONG, HYUNG SU
分类号 H01L33/12 主分类号 H01L33/12
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