| 摘要 |
A semiconductor package testing apparatus comprises a test substrate that electrically tests a semiconductor package chip; a socket having an electrical contact between the test substrate and the semiconductor package; an insert block inserted into the socket, wherein the semiconductor package is mounted to the insert block; and a pusher that brings the socket into contact with the semiconductor package by compressing an upper part of the semiconductor package, wherein the pusher is multilevel-controlled to compress the semiconductor package by a predefined pressure according to a thickness of the semiconductor package.
|
