| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an interposer that improves precision of alignment between a top-surface pattern and a reverse-surface pattern, even if a semiconductor device using an organic substrate as the interposer has a displacement between the top-surface pattern and reverse-surface pattern or a deformation of the substrate itself, and to provide a method of manufacturing the semiconductor device employing the same. <P>SOLUTION: An alignment mark 3 of the interposer is configured such that the alignment mark 3 formed on one principal surface is exposed from the other principal surface through a recess 7. Further, this interposer is used to perform alignment for printing and alignment for division into individual pieces. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
