发明名称 PHOTOELECTRIC CONVERSION SUBMOUNT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a photoelectric conversion submount substrate having high reliability since an external waveguide film 3 is kept from exfoliating by preventing an under-film 5 from reaching a film bonding surface to suppress a deterioration in the connection strength of the waveguide film 3 to a substrate 1. <P>SOLUTION: The photoelectric conversion submount substrate includes a substrate 1, a core layer 21 formed on a recessed face 20 of a surface of the substrate, an optical wave guide 2 for covering and sealing the core layer 21 while comprising a cladding layer 22 with its upper edge formed so as to project from the surface of the substrate, an optical element 4 optically coupled 4 to the wave guide 2, an under fill 5 put between the optical element 4 and the wave guide 2, and the external waveguide film 3 with its end bonded to the surface of the substrate. An outflow preventer 10 is formed on the surface of the substrate and between the optical element 4 and the end of the waveguide film 3 to prevent the under fill 5 from reaching a bonding surface of the waveguide film 3 to the surface of the substrate, the under fill having flowed out from between the optical element 4 and the wave guide 2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011033659(A) 申请公布日期 2011.02.17
申请号 JP20090176930 申请日期 2009.07.29
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 YAMAJI TADAHIRO
分类号 G02B6/42;G02B6/122;H01S5/022 主分类号 G02B6/42
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