| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power semiconductor module having a sandwich structure. <P>SOLUTION: This invention describes the power semiconductor module including at least one first load terminal body and one second load terminal body, and at least one sandwich structure 40 including a first metal shaped body 42, a power semiconductor component 44 and a second metal shaped body 46. In this case, the components of the sandwich structure 40 are adhesively bonded to one another and an edge region of the power semiconductor component 44 is enclosed by an electrically insulating polymer material 80 having a high thermal conductivity. What is essential in this case is that the polymer material 80 is in thermally conductive contact with at least one of the first and second metal shaped bodies 42 and 46. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
