摘要 |
<p>A bonding apparatus for bonding a thermoplastic pad (38) having a predetermined peripheral shape to a first surface of a carpet (c) using radio frequency energy includes a die electrode (22) and a backing electrode (14). Both the die electrode and the backing electrode have a peripheral shape that corresponds to the peripheral shape of the pad. In addition, both the die electrode and the backing electrode may have a relief feature (18, 24) thereon that are correspondingly sized and located. Concentrations of electric field intensity in the vicinity of the peripheral edge of the die electrode and along the edges of the relief feature on the die electrode are minimized so that bonding of a pad to a carpet may be effected without thermal runway. The pad is fully bonded to the carpet without the occurrence of localized burning of the carpet pile or perforation of the pad.</p> |