发明名称 |
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To ensure electrical conduction between an electronic component mounted on a glass base material and an external electrode provided on the side opposite to the component mounted on the base, when a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point.SOLUTION: An electronic device includes: a base 10; a through electrode 21 which passes through the base 10 and has a metal film 22 formed on both end surfaces after an insulating material on the surface is removed by polishing; an electronic component 40 which is provided on one surface of the through electrode 21 through a connection portion 30; an external electrode 70 which is provided on the side opposite to a side of the base 10 on which the electronic component 40 is provided; and a cap 50 which protects the electronic component 40 on the base 10. |
申请公布号 |
JP2011010143(A) |
申请公布日期 |
2011.01.13 |
申请号 |
JP20090152973 |
申请日期 |
2009.06.26 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
NAKAMURA NORIHIKO;SATO KEIJI;TAKEUCHI HITOSHI;TERADA DAISUKE;ARATAKE KIYOSHI;NUMATA SATOSHI |
分类号 |
H03H9/02;H01L23/04;H01L23/08;H03H3/02 |
主分类号 |
H03H9/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|