A method of encapsulating a flexible optoelectronic multi-layered structure

摘要

The invention relates to a method of encapsulating a flexible optoelectronic multi-layered structure (6) provided on a polymer substrate (2) comprising the steps of providing the flexible optoelectronic multi-layered structure with one or both a bottom encapsulation stack (B) and a top encapsulation stack (T),
wherein the bottom encapsulation stack and the top encapsulation layer comprise a first inorganic layer (4a, 8a) separated from a second inorganic layer (4b, 8b) by a substantially continuous getter layer (5, 8) comprising a metal oxide, the first and the second inorganic layers having an intrinsic water vapour transmission of 10 -5 g.m -2 .day -1 or less.