| 摘要 |
<p>Disclosed is a process for producing a wiring board that has a small via diameter and comprises a fine wiring. The process is characterized by comprising the steps of forming an insulating resin layer (3) on an electrocondutive film (2), forming a metal chloride and/or a metal sulfate (5) on the insulating resin layer, forming a protective layer (6) on the metal chloride and/or a metal sulfate, forming an exposed part (7) in the insulating resin layer, the metal chloride and/or the metal sulfate and the protective layer so that a part of the electroconductive film is exposed, removing a residue (8) within the exposed part, removing the protective layer, and forming a wiring (11) on the insulating resin layer after the formation of the exposed part, the removal of the residue, and the removal of the protective layer.</p> |
