发明名称 |
Sensor configuration without housing |
摘要 |
The present invention relates to a method for manufacturing a housing-less sensor, in particular a proximity sensor. Here it is proposed to build all of the components needed for the mechanical and electrical functions on one sensor chassis and then to inject a plastic compound around the components.
|
申请公布号 |
US2010319470(A1) |
申请公布日期 |
2010.12.23 |
申请号 |
US20100816791 |
申请日期 |
2010.06.16 |
申请人 |
BAUMER INNOTEC AG |
发明人 |
WEHRLE WOLFGANG;JUERGENS ALEXANDER |
分类号 |
G01D7/00;B23K31/02;B32B37/24 |
主分类号 |
G01D7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|