发明名称 |
POWER MODULE FABRICATION PROCESS |
摘要 |
The method involves producing an integrated punched grid. The punched grid is assembled with semiconductor components, possible passive assembly parts and bonding corresponding connections. The recesses at predetermined positions remain in the envelop in the power module during enveloping. A subsequent cutting out of bars of integral punched grid takes place through the mounting die inserted in the recesses, by producing electrically insulated islands of punched grid material of the integral punched grid. |
申请公布号 |
EP2261971(A1) |
申请公布日期 |
2010.12.15 |
申请号 |
EP20100008598 |
申请日期 |
2008.04.02 |
申请人 |
DANFOSS SILICON POWER GMBH |
发明人 |
ULRICH, HOLGER;SENYILDIZ, TEOMAN;EISELE, RONALD |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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