| 摘要 |
PROBLEM TO BE SOLVED: To obtain a conductive connection without fail by concurrently pressurizing and heating an ACF efficiently, in a conductive connection device of simple configuration. SOLUTION: An injection nozzle 5 for spraying heated high pressure air to the ACF 3b is provided, and the injection nozzle 5 is supported by a nozzle supporting mechanism 2 while movement is allowed, and the heated high pressure air is supplied from an air supply source 6 to the injection nozzle 5. The ACF 3b is attached on a liquid crystal panel 3, and a chip is temporary pressure-contacted onto the liquid crystal panel 3. The heated high pressure air is sprayed to the ACF 3b while moving the injection nozzle 5, and the chip is pressure-contacted to make current to conduct to a panel electrode. COPYRIGHT: (C)2011,JPO&INPIT
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