发明名称 METHOD OF MOUNTING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PACKAGING SYSTEM
摘要 PROBLEM TO BE SOLVED: To prevent management data from being lost, and to prevent attachment operation from being stopped. SOLUTION: Management data, or the like are written and stored in a server 31 outside an electronic component mounting apparatus 1 for each production of a printed board P. However, when a communication failure occurs between the electronic component mounting apparatus 1 and the server 31, the data are temporarily stored as buffer data in a nonvolatile memory 29 of the electronic component mounting apparatus 1. When the communication failure is solved for recovery, the buffer data stored in the nonvolatile memory 29 are transferred to the server 31. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010262949(A) 申请公布日期 2010.11.18
申请号 JP20090110169 申请日期 2009.04.28
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 KATSUTA SHIGEO;KOYAMA TOMIKIYO;WADA TOSHIAKI;HIRANO KATSUMI
分类号 H05K13/04 主分类号 H05K13/04
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