| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an interposer, and a joint structure of a solder joint between an electrode of the interposer and a solder joint configured, wherein reliability of electronic equipment can be improved without performing a reinforcing operation such as an operation for charging and curing an underfill between the interposer and a motherboard. <P>SOLUTION: An external connection electrode 2 of the interposer 1 has a stack having a first metal layer 2a made of copper, a second metal layer 2b made of nickel, and a third metal layer 2c made of gold laminated in this order, the third metal layer 2c forming a top surface. A solder joint 50 where the external connection electrode 2 of the interposer 1 and a solder ball 40 are joined together has a copper-nickel-tin alloy formed of copper of the first metal layer 2a, nickel of the second metal layer 2b, and tin contained in the solder ball 40 on an interface between the external connection electrode 2 and solder ball 40. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
