| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board capable of obtaining a circuit board with solder bumps which does not have short-circuitings produced among adjacent solder bumps, without installing special processes, and to provide an electronic device that uses the board. <P>SOLUTION: In the circuit board, a plurality of terminal electrodes 2 are arrayed on a main surface, and a gold layer 2a is formed on the top surface of the terminal electrode 2. A resist layer 3 is formed which includes an outer peripheral part 3a, covering the periphery of the gold layer 2a and a protruding part 3b, which extends from at least two points of the outer peripheral part 3a toward the center of the gold layer 2a that covers a part of the gold layer 2a. In the circuit board with a bump, the protruding part 3b of the resist layer 3 is bent and is erected from the outer peripheral part 3a, and the solder bumps are formed, in such manner as being supported by the protruding part 3b on the gold layer 2a, and preventing short-circuitings among umps. <P>COPYRIGHT: (C)2011,JPO&INPIT |
