发明名称 COMPOUND LIQUID FOR POLYMER MOLDING, POLYMER MOLDED BODY, AND COMPOSITE POLYMER MOLDED BODY
摘要 PROBLEM TO BE SOLVED: To provide a compound liquid for polymer molding with a sufficient mold filling property in a molding operation without the problem of dispersion failure of a thermally expandable microcapsule or a filler, or viscosity increase derived from inclusion of these components, and also to provide a lightweight polymer molded body with the excellent rigidity and size stability, and a composite polymer molded body using the above body. SOLUTION: The compound liquid for polymer molding includes a substrate material, a filler, a thermally expandable microcapsule, and a metal salt dispersant, a polymer molded body using the compound liquid, and a composite polymer molded body using the above body. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010235699(A) 申请公布日期 2010.10.21
申请号 JP20090083099 申请日期 2009.03.30
申请人 NIPPON ZEON CO LTD 发明人 MIURA TAKAHIRO
分类号 C08G61/06;B29C45/00;B29C45/14;C08J9/32;C08L65/00 主分类号 C08G61/06
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