DIELECTRIC RESIN COMPOSITION FOR USE IN FILM CONDENSER, AND FILM CONDENSER

摘要

In order to increase the heat resistance of a film condenser, as a material of a dielectric resin film for use in the film condenser, a dielectric resin composition, which provides a cured material by mixing two or more kinds of organic materials including at least first and second organic materials (11) and (12) having functional groups (16) and (18) reacted with each other, respectively, and cross-linking the organic materials to each other, is used. The end of a side chain (15) of the first organic material (11) has a molecular cohesive energy larger than that of a methyl group and has a highly cohesive atomic group (17) capable of cohering with the other atom group due to the molecular cohesive energy, and the highly cohesive atomic groups (17) form a coherent moiety (20) serving as a pseudo-crosslinkage.