发明名称 |
SEMICONDUCTOR APPARATUS AND HEAT CONDUCTIVE SHEET |
摘要 |
A semiconductor apparatus is comprising a circuit board with a semiconductor device surface-mounted on one surface thereof. A heatsink is disposed and fixed with a connection member and separated with a predetermined distance on one side of the circuit board opposite to the surface where the semiconductor device is mounted. A heat conductive sheet is provided between the circuit board and the heatsink and thermally connecting the semiconductor device and the heatsink through the circuit board. The heat conductive sheet is constituted as a laminate of a first member and a second member and one of the first and second members is a ceramic board whereas the other is a resin sheet material having highly heat conductive fillers mixed therein.
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申请公布号 |
US2010246139(A1) |
申请公布日期 |
2010.09.30 |
申请号 |
US20100729369 |
申请日期 |
2010.03.23 |
申请人 |
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI;TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
SUZUKI SADANORI;OZAKI KIMINORI;KOIKE YASUHIRO;OMIYA YUJI |
分类号 |
H05K7/20;F28F7/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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