| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a cured product layer on a surface resin layer of a substrate where a circuit has been formed and the surface resin layer has a predetermined pattern, the photosensitive resin composition having excellent resolution, adhesion property, photosensitivity and plating durability as well as excellent peel properties. <P>SOLUTION: The following photosensitive resin composition is used to form the cured product layer on the surface resin layer of the substrate where the circuit has been formed and the surface resin layer has the predetermined pattern. The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond in the molecule, and (C) a photopolymerization initiator, wherein the total molar number of ethylenically unsaturated groups included in the component (B) per 1 kg of the solid content in the photosensitive resin composition is from 1.5 to 3.5. <P>COPYRIGHT: (C)2010,JPO&INPIT |
