| 摘要 |
A transducer (20) includes sensors (28, 30) that are bonded to form a vertically integrated configuration. The sensor (28) includes a proof mass (32) movably coupled to and spaced apart from a surface (34) of a substrate (36). The sensor (30) includes a proof mass (58) movably coupled to and spaced apart from a surface (60) of a substrate (56). The substrates (36, 56) are coupled with the surface (60) of substrate (56) facing the surface (34) of substrate (36). Thus, the proof mass (58) faces the proof mass (32). The sensors (28, 30) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors (28, 30) are subsequently coupled (90) utilizing a wafer bonding technique to form the transducer (20). Embodiments of the transducer (20) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.
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